The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Apr. 28, 2020
Murata Manufacturing Co., Ltd., Kyoto, JP;
Tadashi Nomura, Kyoto, JP;
Masahiro Inoue, Kyoto, JP;
Tetsuya Oda, Kyoto, JP;
Hideki Shinkai, Kyoto, JP;
Toru Koidesawa, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A circuit module () includes a substrate () having a plurality of internal conductors (), a first electronic component disposed on one principal surface (S) of the substrate (), a first resin layer () provided on the one principal surface (S) and sealing the first electronic component, a plurality of outer electrodes (B) provided on the other principal surface (S) of the substrate () and including a ground electrode, a conductor film () at least provided on an outer surface of the first resin layer () and a side surface (S) of the substrate () and connected to the ground electrode via at least one of the plurality of internal conductors (), and a resin film ().