The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Oct. 21, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Joonrae Cho, Suwon-si, KR;

Yousang Nam, Suwon-si, KR;

Choonghyo Park, Suwon-si, KR;

Byounghee Lee, Suwon-si, KR;

Hochul Hwang, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 9/06 (2006.01); H04R 7/04 (2006.01); H04R 7/18 (2006.01); H04R 1/02 (2006.01); H04R 9/02 (2006.01);
U.S. Cl.
CPC ...
H04R 9/06 (2013.01); H04R 1/028 (2013.01); H04R 7/04 (2013.01); H04R 7/18 (2013.01); H04R 9/025 (2013.01); H04R 2400/11 (2013.01); H04R 2499/11 (2013.01); H04R 2499/15 (2013.01);
Abstract

A speaker module including an inclined diaphragm and to an electronic device is provided. The speaker module includes the speaker module, the speaker module including a yoke configuring one surface of the speaker module, a magnet including one surface arranged on an inner surface of the yoke, a frame configuring a side surface of the speaker module and including a first end portion connected to the yoke, a voice coil spaced apart from the magnet and including at least a portion overlapping the magnet, and a diaphragm comprising an inner surface on which the voice coil is arranged. The diaphragm is connected to a second end portion opposite to the first end portion of the frame and is inclined to be non-perpendicular to an outer surface of the frame, so that a sound in a high-frequency band output through the speaker module can be smoothly transmitted outside the electronic device.


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