The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Oct. 25, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Danielle DeGraw, Pleasant Valley, NY (US);

Yat-Kiu-Kent Fung, Woodside, NY (US);

James Robert Rozen, Peekskill, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/06 (2006.01); H01P 11/00 (2006.01); H01B 12/00 (2006.01); C25D 3/12 (2006.01); C25D 5/12 (2006.01); C25D 7/06 (2006.01); B23K 1/00 (2006.01); C25D 3/38 (2006.01); B23K 101/38 (2006.01);
U.S. Cl.
CPC ...
H01P 3/06 (2013.01); B23K 1/0008 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 5/12 (2013.01); C25D 7/0607 (2013.01); H01B 12/00 (2013.01); H01P 11/005 (2013.01); B23K 2101/38 (2018.08);
Abstract

The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.


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