The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Oct. 13, 2017
Semiconductor Components Industries, Llc, Phoenix, AZ (US);
Bingzhi Su, Boise, ID (US);
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);
Abstract
Implementations of semiconductor packages may include: a wafer having a first side and a second side, a solder pad coupled to the first side of the wafer, a through silicon via (TSV) extending from the second side of the wafer to the solder pad a metal layer around the walls of the TSV, and a low melting temperature solder in the TSV. The low melting temperature solder may also be coupled to the metal layer. The low melting temperature solder may couple to the solder pad through an opening in a base layer metal of the solder pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile