The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Jun. 13, 2019
International Business Machines Corporation, Armonk, NY (US);
Yann Mignot, Slingerlands, NY (US);
Hsueh-Chung Chen, Cohoes, NY (US);
Junli Wang, Slingerlands, NY (US);
Chi-Chun Liu, Altamont, NY (US);
Mary Claire Silvestre, Clifton Park, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
An interconnect structure is provided. The interconnect structure includes a first metallization layer, an insulating layer and a second metallization layer. The first metallization layer includes, at an uppermost surface thereof, a first body formed of first dielectric material, first metallic elements and buffer elements formed of second dielectric material adjacent the first metallic elements. The insulating layer is disposed on the uppermost surface of the first metallization layer and defines apertures located at the first metallic elements and the corresponding buffer elements. The second metallization layer is disposed on the insulating layer and includes a second body formed of first dielectric material and second metallic elements located at the apertures and extending through the apertures to contact the corresponding first metallic elements and the corresponding buffer elements.