The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Oct. 16, 2019
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Hsueh-Hsuan Chou, Miao-Li County, TW;

Chia-Chieh Fan, Miao-Li County, TW;

Cheng-Chi Wang, Miao-Li County, TW;

Kuan-Jen Wang, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 21/78 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 22/14 (2013.01); H01L 22/32 (2013.01); H01L 23/3114 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/97 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/05611 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/80411 (2013.01); H01L 2224/80444 (2013.01); H01L 2224/80455 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/37001 (2013.01);
Abstract

A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.


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