The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Jun. 24, 2019
Takeshi Bessho, Toyota, JP;
Masataka Deguchi, Nagoya, JP;
Nagahiro Saito, Nagoya, JP;
Kazuo Hashimi, Nagoya, JP;
Takeshi Bessho, Toyota, JP;
Masataka Deguchi, Nagoya, JP;
Nagahiro Saito, Nagoya, JP;
Kazuo Hashimi, Nagoya, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota, JP;
NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY, Nagoya, JP;
Abstract
The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease. The self-assembled monolayer is formed on at least one surface of the first member and the second member. The heat dissipation grease is disposed between the first member and the second member. The heat dissipation grease is in contact with the self-assembled monolayer.