The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Dec. 08, 2016
Murata Manufacturing Co., Ltd., Kyoto, JP;
Shinichiro Banba, Kyoto, JP;
Yoshihito Otsubo, Kyoto, JP;
Norio Sakai, Kyoto, JP;
Mitsuyoshi Nishide, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
Substrate-side wiring electrode patterns, which form a part of a coil electrode, are provided on a wiring substrate, and as a result reductions in the size and profile of a resin insulating layer, in which a coil coreis buried, can be achieved. Therefore, reductions in the size and the profile of a coil modulecan be achieved compared with a coil module of the related art which is formed by mounting a coil component on a wiring substrate. In addition, since the substrate-side wiring electrode patterns, which form a part of the coil electrode, are provided on the wiring substrate, the heat generated by a coilcan be efficiently released from the substrate-side wiring electrode patternsto the wiring substrate. Therefore, the heat dissipation property of the coil modulecan be improved at low cost.