The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

May. 29, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Chien-Min Liao, San Jose, CA (US);

Yao-Hung Yang, Santa Clara, CA (US);

Hsiu Yang, Santa Clara, CA (US);

Jeevan Shanbhag, Cupertino, CA (US);

Chun-Chung Chen, San Jose, CA (US);

Tom K. Cho, Los Altos, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 7/14 (2006.01); G06Q 10/08 (2012.01); H04L 9/06 (2006.01);
U.S. Cl.
CPC ...
G06K 7/1417 (2013.01); G06Q 10/087 (2013.01); H04L 9/0643 (2013.01);
Abstract

The present disclosure relates to systems and methods for semiconductor tool part tracking and kit verification. Data relating to part identification and performance are encoded to a unique code that is encoded into machine-readable form, such as a data matrix. A multi-dimensional array (MDA) of the data matrices of a group of parts is a 'golden MDA'. When assembled into a kit, the parts are scanned and compared to the golden MDA. If there's a match, a kit unique code is used to generate a kit data matrix. The part data matrix codes are provided to a database to determine if a part combination will cause a coupling effect, based on part usage history.


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