The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 27, 2021

Filed:

Mar. 28, 2019
Applicant:

Northeastern University, Boston, MA (US);

Inventors:

Meni Wanunu, Needham, MA (US);

Hirohito Yamazaki, Brighton, MA (US);

Assignee:

Northeastern University, Boston, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); C04B 41/53 (2006.01); G01N 21/59 (2006.01); G03F 7/11 (2006.01); G03F 7/004 (2006.01);
U.S. Cl.
CPC ...
G03F 7/2043 (2013.01); C04B 41/5353 (2013.01); G01N 21/59 (2013.01); G03F 7/0041 (2013.01); G03F 7/11 (2013.01); G03F 7/2053 (2013.01);
Abstract

A method for etching a light absorbing material permits directly writing a pattern of etching of silicon nitride and other light absorbing materials, without the need of a lithographic mask, and allows the creation of etched features of less than one micron in size. The method can be used for etching deposited silicon nitride films, freestanding silicon nitride membranes, and other light absorbing materials, with control over the thickness achieved by optical feedback. The etching is promoted by solvents including electron donor species, such as chloride ions. The method provides the ability to etch silicon nitride and other light absorbing materials, with fine spatial and etch rate control, in mild conditions, including in a biocompatible environment. The method can be used to create nanopores and nanopore arrays.


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