The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2021
Filed:
Jan. 20, 2015
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Fernando Juan, Sant Cugat del Valles, ES;
Pau Martin Vidal, Sant Cugat del Valles, ES;
Esteve Comas, Sant Cugat del Valles, ES;
Jordi Gimenez Manent, Sant Cugat del Valles, ES;
Pol Morral, Sant Cugat del Valles, ES;
Pablo Dominguez Pastor, Sant Cugat del Valles, ES;
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 12/00 (2021.01); B29C 64/259 (2017.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B23K 26/342 (2014.01); B29C 64/255 (2017.01); B29C 64/295 (2017.01); B29C 64/393 (2017.01); B22F 10/10 (2021.01); B29C 64/153 (2017.01);
U.S. Cl.
CPC ...
B22F 12/38 (2021.01); B22F 12/00 (2021.01); B23K 26/342 (2015.10); B29C 64/255 (2017.08); B29C 64/259 (2017.08); B29C 64/295 (2017.08); B29C 64/393 (2017.08); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 10/10 (2021.01); B29C 64/153 (2017.08); Y02P 10/25 (2015.11);
Abstract
A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.