The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Dec. 05, 2018
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Thomas Wiesa, Vaihingen, DE;

Andreas Meier, Pfullingen, DE;

Stefan Huehner, Kusterdingen—Jettenburg, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 1/11 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H01L 23/142 (2013.01); H01L 23/3735 (2013.01); H05K 1/053 (2013.01); H05K 1/116 (2013.01); H05K 2201/10303 (2013.01);
Abstract

The present invention relates to a circuit substrate arrangement comprising a base layer () made from aluminium, a circuit layer () made from copper, a dielectric layer () arranged between the base layer () and the circuit layer (), an opening () passing through the base layer (), the circuit layer () and the dielectric layer () and an electrical contact () between the base layer () and the circuit layer (), wherein the electrical contact () comprises a rivet (), wherein a frictionally connected joint () is formed between the rivet () and the base layer () and wherein an integrally bonded joint () is formed between the rivet () and the circuit layer ().


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