The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Mar. 12, 2018
Flir Systems, Inc., Wilsonville, OR (US);
Brian Simolon, Santa Barbara, CA (US);
Eric A. Kurth, Santa Barbara, CA (US);
Mark Nussmeier, Goleta, CA (US);
Nicholas Högasten, Santa Barbara, CA (US);
Theodore R. Hoelter, Goleta, CA (US);
Katrin Strandemar, Rimbo, SE;
Pierre Boulanger, Goleta, CA (US);
Barbara Sharp, Santa Barbara, CA (US);
FLIR Systems, Inc., Wilsonville, OR (US);
Abstract
Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.