The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Sep. 24, 2019
Applicant:

Nidec Tosok Corporation, Kanagawa, JP;

Inventors:

Yoshiyuki Kobayashi, Kanagawa, JP;

Hitoshi Sakamoto, Kanagawa, JP;

Tomohiro Sakata, Kanagawa, JP;

Chisato Sekiguchi, Kanagawa, JP;

Hirotaka Kanamono, Kanagawa, JP;

Assignee:

NIDEC TOSOK CORPORATION, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 9/22 (2006.01); H02K 3/46 (2006.01); H02K 7/14 (2006.01); H02K 11/33 (2016.01);
U.S. Cl.
CPC ...
H02K 9/22 (2013.01); H02K 3/46 (2013.01); H02K 7/14 (2013.01); H02K 11/33 (2016.01);
Abstract

An inverter substrate has a plurality of heat generating elements mounted thereon and disposed at intervals from each other. A housing has an inverter housing section that accommodates the inverter substrate. The inverter housing section has a first member that faces one plate surface of a pair of plate surfaces of the inverter substrate, a second member that faces the other plate surface of the pair of plate surfaces, and a plurality of heat conductive sheets that are disposed between the first member or the second member and the inverter substrate and are brought into contact with the first member or the second member and the inverter substrate. The heat conductive sheets are thermally connected to the heat generating elements. The heat conductive sheets are individually disposed at positions at which the heat conductive sheets overlap the plurality of heat generating elements in a plan view of the inverter substrate.


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