The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Jun. 29, 2019
Applicant:

AU Optronics Corporation, Hsinchu, TW;

Inventors:

Pei-Yun Wang, Taoyuan, TW;

Chia-Kai Chen, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); H01L 27/3246 (2013.01); H01L 27/3258 (2013.01); H01L 27/3262 (2013.01); H01L 27/3276 (2013.01); H01L 2227/323 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/558 (2013.01);
Abstract

An active device substrate including a flexible substrate, an inorganic insulation layer, an organic insulation pattern, a conductive device and a peripheral wiring is provided. The flexible substrate has an active region, a peripheral region outside the active region and a bending region connected between the active region and the peripheral region. The inorganic insulation layer is disposed on the flexible substrate and has a groove disposed in the bending region. The organic insulation pattern is disposed in the groove of the inorganic insulation layer. The peripheral wiring is extended from the active region to the conductive device in the peripheral region. The peripheral wiring is disposed on the organic insulation pattern, and the organic insulation pattern is located between the peripheral wiring and the flexible substrate.


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