The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Mar. 16, 2018
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Adrian Stefan Avramescu, Regensburg, DE;

Tansen Varghese, Regensburg, DE;

Martin Straßburg, Donaustauf, DE;

Hans-Jürgen Lugauer, Sinzing, DE;

Sönke Fündling, Braunschweig, DE;

Jana Hartmann, Braunschweig, DE;

Frederik Steib, Wolfsburg, DE;

Andreas Waag, Würzburg, DE;

Assignee:

OSRAM OLED GMBH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 25/0753 (2013.01); H01L 33/0025 (2013.01); H01L 33/0066 (2013.01);
Abstract

An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.


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