The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Nov. 21, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Josephine B. Chang, Bedford Hills, NY (US);

Michael A. Guillorn, Cold Springs, NY (US);

Isaac Lauer, Yorktown Heights, NY (US);

Xin Miao, Slingerlands, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01); H01L 29/423 (2006.01); H01L 29/10 (2006.01); H01L 21/84 (2006.01); H01L 29/417 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0673 (2013.01); H01L 21/84 (2013.01); H01L 27/1203 (2013.01); H01L 27/1211 (2013.01); H01L 29/0649 (2013.01); H01L 29/0676 (2013.01); H01L 29/0847 (2013.01); H01L 29/1033 (2013.01); H01L 29/41741 (2013.01); H01L 29/42392 (2013.01); H01L 29/6653 (2013.01); H01L 29/6656 (2013.01); H01L 29/66439 (2013.01); H01L 29/66545 (2013.01); H01L 29/66553 (2013.01); H01L 29/66666 (2013.01); H01L 29/66795 (2013.01); H01L 29/7827 (2013.01);
Abstract

Field effect transistors and methods of forming the same include forming a stack of nanosheets of alternating layers of channel material and sacrificial material. A layer of sacrificial material forms a top layer of the stack. A dummy gate is formed over the stack. Stack material outside of a region covered by the dummy gate is removed. The sacrificial material is etched to form recesses in the sacrificial material layers. Spacers are formed in the recesses in the sacrificial material layers. At least one pair of spacers is formed in recesses above an uppermost layer of channel material. The dummy gates are etched away. The top layer of sacrificial material protects an uppermost layer of channel material from damage from the anisotropic etch. The sacrificial material is etched away to expose the layers of channel material. A gate stack is formed over, around, and between the layers of channel material.


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