The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
May. 10, 2017
Applicant:
Sony Corporation, Tokyo, JP;
Inventor:
Jo Umezawa, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 21/4853 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/562 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/214 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A metal frame that is used in a dummy wafer in which chip-like semiconductor elements and a rewiring layer are integrated. A plurality of openings in which the chip-like semiconductor elements are disposed are formed in the metal plate, and a lattice structure is formed with the frames that are the portions between adjacent openings of the plurality of openings. Of the frames forming the lattice structure, the frames located in dicing areas of the dummy wafer are arranged in a discontinuous manner.