The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Nov. 15, 2019
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Takashi Iwamoto, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
An electronic component module includes an electronic component, a resin structure, a through wire, and a wiring layer. The resin structure covers at least a portion of the electronic component. The through wire extends through the resin structure in a predetermined direction. The wiring layer electrically connects the electronic component to the through wire. The wiring layer includes a portion located between the electronic component and the through wire in plan view in the predetermined direction. The wiring layer has a protruding portion. The protruding portion protrudes in the predetermined direction between the electronic component and the through wire.