The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Jul. 23, 2019
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Kenshi Kai, Matsumoto, JP;

Rikihiro Maruyama, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 13/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 24/27 (2013.01); B23K 35/025 (2013.01); B23K 35/262 (2013.01); C22C 13/00 (2013.01); H01L 21/4871 (2013.01); H01L 23/3735 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29213 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29263 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01083 (2013.01);
Abstract

A conductive plate has a front surface at a front side and a rear surface at a rear side. The front surface includes a first front surface on which a first arrangement region is disposed and a second front surface on which a second arrangement region is disposed. The first front surface has a height measured from the rear surface that is different from a height of the second front surface measured from the rear surface. Next, first and second bonding materials are respectively applied to the first and second arrangement regions. A first part is bonded to the first arrangement region via the first bonding material, and a second part is bonded to the second arrangement region via the second bonding material. The heights of the first and second arrangement regions set on the front surface on the conductive plate are different from each other.


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