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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11069638 B1

PDFFull Text
Date of Patent:
Jul. 20, 2021

Filed:

Aug. 02, 2019

Method for fabricating the electronic component, and method for transposing a micro-element

Applicant:

AU Optronics Corporation, Hsin-Chu, TW;

Inventors:

Yi-Cheng Liu, Hsin-Chu, TW;

Ho-Cheng Lee, Hsin-Chu, TW;

Chung-Chan Liu, Hsin-Chu, TW;

Assignee:

AU OPTRONICS CORPORATION, Hsin-Chu, TW;

Attorney:

WPAT, PC

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Valerie N Newton

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 33/62 (2010.01); H01L 27/12 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 27/1214 (2013.01); H01L 33/62 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03831 (2013.01); H01L 2224/03848 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/0558 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/29023 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75312 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83365 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometers or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.

Find Patent Forward Citations

Liu, Yi-Cheng. (2021). Method for fabricating the electronic component, and method for transposing a micro-element (U.S. Patent No. 11069638). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11069638

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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