The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Sep. 04, 2019
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/528 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3178 (2013.01); H01L 21/78 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01); H01L 23/3114 (2013.01); H01L 23/3142 (2013.01); H01L 23/3171 (2013.01); H01L 23/3192 (2013.01); H01L 23/528 (2013.01); H01L 23/544 (2013.01); H01L 23/562 (2013.01); H01L 24/02 (2013.01); H01L 24/10 (2013.01); H01L 24/13 (2013.01); H01L 24/94 (2013.01); H01L 24/96 (2013.01); H01L 24/05 (2013.01); H01L 2223/5446 (2013.01); H01L 2224/024 (2013.01); H01L 2224/0226 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02255 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/05001 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05569 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/16 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/05042 (2013.01); H01L 2924/05442 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/10161 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/182 (2013.01); H01L 2924/186 (2013.01); H01L 2924/3025 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip having a passivation film, a stress relieving layer provided on the passivation film, and a groove formed in a periphery of a surface of the semiconductor chip, the groove being provided inside of an edge of the semiconductor chip, wherein the stress relieving layer is partly disposed in the groove.