The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Oct. 26, 2017
Applicant:

Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;

Inventors:

Soichiro Umeda, Saitama, JP;

Atsushi Kyutoku, Saitama, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 21/8234 (2006.01); H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/485 (2013.01); H01L 21/56 (2013.01); H01L 21/8234 (2013.01); H01L 23/49551 (2013.01); H01L 23/49565 (2013.01); H01L 2021/6027 (2013.01); H01L 2224/3226 (2013.01); H01L 2224/32258 (2013.01);
Abstract

The one end portion of the connector of the semiconductor device includes: a horizontal portion; a first inclined portion that is connected to the horizontal portion and is located closer to the tip end side of the one end than the horizontal portion, and the first inclined portion having a shape inclined downward from the horizontal portion; and a control bending portion that is connected to the first inclined portion and positioned at the tip of the one end portion, and the control bending portion bent downwardly along the bending axis direction. The lower surface of the control bending portion is in contact with an upper surface of the second terminal.


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