The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Nov. 19, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Sebastian Meier, Munich, DE;

Helmut Rinck, Moosburg, DE;

Mike Mittelstaedt, Berglern, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/28 (2006.01); H01L 21/311 (2006.01); C01G 55/00 (2006.01); H01L 21/263 (2006.01); H01L 29/49 (2006.01); H01L 21/3213 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H01L 23/532 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28052 (2013.01); C01G 55/00 (2013.01); C01G 55/004 (2013.01); H01L 21/02068 (2013.01); H01L 21/2633 (2013.01); H01L 21/28518 (2013.01); H01L 21/31122 (2013.01); H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 21/76885 (2013.01); H01L 21/76895 (2013.01); H01L 23/53242 (2013.01); H01L 24/00 (2013.01); H01L 28/24 (2013.01); H01L 29/4975 (2013.01); H01L 29/665 (2013.01); H01L 29/6659 (2013.01); H01L 29/7833 (2013.01); H01L 21/76834 (2013.01); H01L 21/823814 (2013.01); H01L 21/823835 (2013.01);
Abstract

A microelectronic device is formed by forming a platinum-containing layer on a substrate of the microelectronic device. A cap layer is formed on the platinum-containing layer so that an interface between the cap layer and the platinum-containing layer is free of platinum oxide. The cap layer is etchable in an etch solution which also etches the platinum-containing layer. The cap layer may be formed on the platinum-containing layer before platinum oxide forms on the platinum-containing layer. Alternatively, platinum oxide on the platinum-containing layer may be removed before forming the cap layer. The platinum-containing layer may be used to form platinum silicide. The platinum-containing layer may be patterned by forming a hard mask or masking platinum oxide on a portion of the top surface of the platinum-containing layer to block the wet etchant.


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