The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Jul. 09, 2019
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Hideki Furusawa, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/00 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01); B22F 7/04 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); B22F 7/04 (2013.01); H01G 4/1227 (2013.01); H01G 4/1236 (2013.01); B22F 2301/10 (2013.01); Y10T 428/12028 (2015.01);
Abstract
Provided is a laminate of a sintered body produced by sintering a copper powder paste and a ceramic substrate, which has improved adhesion between the sintered body and the ceramic substrate. A laminate with a copper powder paste sintered body laminated on a non-metal layer, wherein the copper powder paste sintered body has a crystal grain diameter of copper of 10 μm or less, as determined from an EBSD map image, based on Area Fraction method, and has an average reliability index (CI value) of 0.5 or more in an analysis area.