The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Mar. 13, 2017
Applicant:
Moda-innochips Co., Ltd., Ansan-Si, KR;
Inventors:
In Kil Park, Seongnam-Si, KR;
Seung Hun Cho, Siheung-Si, KR;
Gyeong Tae Kim, Ansan-Si, KR;
Jun Ho Jung, Siheung-Si, KR;
Sang Jun Park, Hwaseong-Si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/32 (2006.01); H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 17/04 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 5/10 (2006.01); C25D 7/00 (2006.01); H05K 1/16 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); C25D 3/38 (2013.01); C25D 5/022 (2013.01); C25D 5/10 (2013.01); C25D 7/00 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/32 (2013.01); H01F 41/041 (2013.01); H01F 41/043 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0073 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01); H01F 2027/2819 (2013.01); H05K 1/165 (2013.01); H05K 3/241 (2013.01); H05K 2203/1476 (2013.01);
Abstract
Provided is a method of forming a coil pattern on at least one surface on a substrate, the method comprising forming a seed layer on at least one surface of a substrate, and forming at least two or more plating layers to cover the seed layer, wherein the two or more plating layers are formed through anisotropic plating.