The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Aug. 30, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Timothy Joseph Chainer, Putnam Valley, NY (US);

Pritish Ranjan Parida, Fishkill, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06G 7/50 (2006.01); G06F 30/20 (2020.01); F24F 11/30 (2018.01); F24F 11/52 (2018.01); G06F 113/18 (2020.01); G06F 119/06 (2020.01); G06F 119/08 (2020.01);
U.S. Cl.
CPC ...
G06F 30/20 (2020.01); F24F 11/30 (2018.01); F24F 11/52 (2018.01); G06F 2113/18 (2020.01); G06F 2119/06 (2020.01); G06F 2119/08 (2020.01);
Abstract

Techniques that facilitate hybrid modeling for a device under test associated with a cooling system (e.g., a two-phase cooling system) are provided. In one example, information indicative of a first model of a device under test associated with a cooling system is determined. Second information indicative of constraints that define values for an operational quantity related to the cooling system is also determined. Information indicative of a second model for the device under test is generated based on the information indicative of the first model and the second information indicative of the one or more constraints. In an aspect, a first simulation process is performed to determine first thermal properties for a first simulation domain associated with the device under test. In another aspect, a second simulation process is performed to determine second thermal properties for a second simulation domain associated with the device under test.


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