The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Aug. 28, 2018
Murata Manufacturing Co., Ltd., Kyoto, JP;
Tadaji Takemura, Kyoto, JP;
Hiromichi Kawakami, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A multilayer circuit boardincludes a core substrate; a resin section, which covers the side surface and a lower surfaceof the core substrate; and a plurality of metal pins, which are disposed within the resin section. The core substrateincludes a ceramic multilayer section, which is disposed on the mother-substrate side of the core substrate; and a resin multilayer section, which is stacked on a main surfaceon a side of the ceramic multilayer section, the side being opposite to the mother substrate. The resin sectionincludes the plurality of metal pins, and a through-hole, which extends through the resin sectionin its thickness direction. A fastening partpenetrates the through-hole, to mount the multilayer circuit boardon the mother substrate.