The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Sep. 07, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Minjin Kim, Seoul, KR;

Youngdoo Jung, Suwon-si, KR;

Eunhee Jung, Hwaseong-si, KR;

Sungeun Jo, Incheon, KR;

Inho Choi, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 33/00 (2006.01); G01N 27/12 (2006.01); G01N 27/407 (2006.01); G01N 27/04 (2006.01); H01L 23/31 (2006.01); H05K 1/03 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 27/02 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
G01N 33/0027 (2013.01); G01N 27/048 (2013.01); G01N 27/123 (2013.01); G01N 27/128 (2013.01); G01N 27/407 (2013.01); H01L 23/02 (2013.01); H01L 23/3107 (2013.01); H01L 23/49805 (2013.01); H01L 24/48 (2013.01); H01L 27/0248 (2013.01); H05K 1/0306 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A gas sensor package includes a package substrate having a hole, the hole having an end that is opened at a first surface of the package substrate; a gas sensor disposed in the hole of the package substrate; a fixing plate disposed on the first surface of the package substrate, the fixing plate having a vent hole extending between a top surface and a bottom surface of the fixing plate, the bottom surface of the fixing plate facing toward the package substrate and the top surface of the fixing plate facing away from the package substrate, and the fixing plate overlapping the hole of the package substrate when viewed in a plan view; and a protective film attached to the fixing plate. The protective film overlaps the vent hole when viewed in a plan view.


Find Patent Forward Citations

Loading…