The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Oct. 15, 2018
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Emanuel Stoicescu, Bucharest, RO;
Matthias Boehm, Putzbrunn, DE;
Stefan Jahn, Munich, DE;
Erhard Landgraf, Dresden, DE;
Michael Weber, Mainburg, DE;
Janis Weidenauer, Munich, DE;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 19/14 (2006.01); H01L 23/053 (2006.01); G01L 19/00 (2006.01); H01L 21/56 (2006.01); H01L 23/24 (2006.01); H01L 23/495 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01L 19/147 (2013.01); G01L 19/0061 (2013.01); H01L 21/56 (2013.01); H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 23/60 (2013.01); H01L 24/45 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/4848 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.