The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Jul. 13, 2018
Mitsubishi Electric Corporation, Tokyo, JP;
Yasutomo Tanihara, Tokyo, JP;
Hiroyuki Chibahara, Tokyo, JP;
Taiki Donen, Tokyo, JP;
Satoshi Ochi, Tokyo, JP;
Takayuki Itotani, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
In an electric contact including a base material, high-melting-point substance particles, and an intermetallic compound, the intermetallic compound containing a MnX compound (X represents Te or Se) and a compound of a Mn—Cu solid-solution phase and X, is dispersed in the base material. If the Vickers hardness of the high-melting-point substance particles is higher than 0 Hv and lower than 200 Hv, the particle diameter of the high-melting-point substance particles is not smaller than 0.1 μm and not larger than 100 μm. If the Vickers hardness of the high-melting-point substance particles is 200 Hv or higher, the particle diameter is not smaller than 0.1 μm and not larger than 10 μm. The mass of X atoms is not lower than 1.5 mass % and not higher than 15 mass %. The atomic weight ratio Mn/(Mn+X) is not lower than 20 at % and not higher than 80 at %.