The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Nov. 29, 2019
Applicant:
Elite Electronic Material (Zhongshan) Co., Ltd., Zhongshan, CN;
Inventors:
Assignee:
ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD., Zhongshan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); C08K 5/54 (2006.01); C08K 3/013 (2018.01); C08J 5/24 (2006.01); C08F 283/08 (2006.01); C08G 65/336 (2006.01); C08F 283/00 (2006.01); C08G 65/48 (2006.01); C08L 55/02 (2006.01); C08L 25/10 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); C08F 283/004 (2013.01); C08F 283/085 (2013.01); C08G 65/336 (2013.01); C08G 65/485 (2013.01); C08J 5/24 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/013 (2018.01); C08K 5/5403 (2013.01); C08J 2371/12 (2013.01); C08J 2409/00 (2013.01); C08J 2425/10 (2013.01); C08L 25/10 (2013.01); C08L 55/02 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2312/08 (2013.01);
Abstract
A resin composition includes a vinyl-containing polyphenylene ether resin and a multifunctional vinylsilane. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board and achieve improvement in at least one of the properties including prepreg or laminate surface appearance, glass transition temperature, ratio of thermal expansion, peel strength, thermal resistance after moisture absorption, thermal resistance, dielectric constant, dissipation factor and inner resin flow.