The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
May. 22, 2020
Sumitomo Seika Chemicals Co., Ltd., Hyogo, JP;
Noriaki Fukuda, Kako-gun, JP;
Ryota Harisaki, Kako-gun, JP;
Katsumasa Yamamoto, Kako-gun, JP;
Nobukatsu Nemoto, Koriyama, JP;
SUMITOMO SEIKA CHEMICALS CO., LTD., Hyogo, JP;
Abstract
The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a Calkylene group, etc.; Ris the same or different, and is a Calkyl group, etc., Ris the same or different, and is a Calkylene group, etc., Ris the same or different, and is a Calkyl group, etc., and n is the same or different, and is an integer of 0 to 3. The present invention also includes a process for producing the same, a cured product of the epoxy resin composition, and use thereof.