The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Apr. 24, 2017
Applicant:

Toyobo Co., Ltd., Osaka, JP;

Inventors:

Shota Hara, Otsu, JP;

Toshiyuki Tsuchiya, Otsu, JP;

Masahiro Yamashita, Otsu, JP;

Tetsuo Okuyama, Otsu, JP;

Naoki Watanabe, Otsu, JP;

Assignee:

TOYOBO CO., LTD., Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); B32B 7/12 (2006.01); B32B 27/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B32B 7/12 (2013.01); B32B 27/00 (2013.01); B32B 2250/05 (2013.01); B32B 2250/24 (2013.01); B32B 2255/10 (2013.01); B32B 2255/24 (2013.01); B32B 2307/306 (2013.01); B32B 2307/308 (2013.01);
Abstract

A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400° C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.


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