The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Dec. 05, 2018
Applicant:

United Technologies Corporation, Farmington, CT (US);

Inventors:

Kerry Lynn Davis, Enfield, CT (US);

William Bogue, Hebron, CT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); B29C 35/02 (2006.01); B29C 65/02 (2006.01); B29K 79/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/55 (2013.01); B29C 35/02 (2013.01); B29C 65/02 (2013.01); B29C 66/004 (2013.01); B29C 66/022 (2013.01); B29C 66/522 (2013.01); B29K 2079/08 (2013.01); B29K 2313/00 (2013.01);
Abstract

A method of sealing a first component to a second component comprising the steps of locating at least one fiber reinforced polyimide resin layer against a first sealing surface on a first component and against a second sealing surface on a second component. At least one fiber reinforced polyimide resin layer is compressed against the first sealing surface and the second sealing surface prior to curing at least one fiber reinforced polyimide resin layer. At least one fiber reinforced polyimide resin layer is heated to promote flow and conformation to the first sealing surface and the second sealing surface. At least one fiber reinforced polyimide resin layer is cured to provide a fluid tight seal between the first component and the second component.


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