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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11065775 B1

PDFFull Text
Date of Patent:
Jul. 20, 2021

Filed:

Jan. 13, 2020

System and method of post-cure processing of composite core

Applicant:

Bell Textron Inc., Fort Worth, TX (US);

Inventors:

Phillip A. Kendrick, Fort Worth, TX (US);

Levi H. Armstrong, Saginaw, TX (US);

Assignee:

TEXTRON INNOVATIONS INC., Providence, RI (US);

Attorney:

Timmer Law Group, PLLC

Primary Examiner:

Linda L Gray

Int. Cl.
CPC ...
B26D 1/00 (2006.01); B29D 99/00 (2010.01); B29C 53/00 (2006.01); B29C 70/00 (2006.01); B26D 7/00 (2006.01); B26D 1/157 (2006.01); B29C 53/60 (2006.01); B29C 70/54 (2006.01); B26D 7/01 (2006.01); B29C 69/00 (2006.01); B26D 1/10 (2006.01); B26D 3/16 (2006.01); B26D 1/08 (2006.01); B29C 65/00 (2006.01); B32B 3/12 (2006.01); B32B 37/14 (2006.01); B29C 70/30 (2006.01);
U.S. Cl.
CPC ...
B26D 1/157 (2013.01); B26D 7/01 (2013.01); B29C 53/60 (2013.01); B29C 69/001 (2013.01); B29C 70/545 (2013.01); B29D 99/0089 (2013.01); B26D 1/08 (2013.01); B26D 1/10 (2013.01); B26D 3/167 (2013.01); B29C 66/543 (2013.01); B29C 70/30 (2013.01); B32B 3/12 (2013.01); B32B 37/146 (2013.01); Y10T 83/04 (2015.04); Y10T 83/0405 (2015.04); Y10T 83/0476 (2015.04); Y10T 83/05 (2015.04); Y10T 83/0524 (2015.04); Y10T 83/0596 (2015.04); Y10T 156/1026 (2015.01); Y10T 156/1059 (2015.01); Y10T 156/1066 (2015.01); Y10T 156/1079 (2015.01); Y10T 156/13 (2015.01); Y10T 156/1348 (2015.01); Y10T 156/1357 (2015.01);
Abstract

A method of cutting a wafer of composite core from a bulk composite core including the steps of placing the bulk composite core in a container, the bulk composite core having a plurality of tube members; depositing a potting compound in contact with an outer surface of the bulk composite core; curing the potting compound; and after curing of the potting compound, cutting through each of the tube members. A method of cutting a wafer of composite core from a bulk composite core, the method comprising the steps of stabilizing the bulk composite core by wrapping an exterior of the bulk composite core with a composite wrap, the bulk composite core having a plurality of tube members; curing the composite wrap; and cutting through each of the tube members.

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