The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Feb. 03, 2017
Hewlett-packard Development Company, L.p., Spring, TX (US);
Gary G. Lutnesky, Corvallis, OR (US);
Matthew David Smith, Corvallis, OR (US);
Dennis R. Esterberg, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
A cassette may include a substrate, a die coupled to the substrate, and an electrical interconnection pad layout formed on a first side of the substrate. The electrical interconnection pad layout may include a first row of interconnect pads including at least one interconnect pad. Each interconnect pad of the first row of interconnect pads may be electrically coupled to one of a first set of vias. The electrical interconnection pad layout may also include a second row of interconnection pads including at least one interconnect pad. Each interconnect pad of the second row of interconnect pads being electrically coupled to one of a second set of vias. The second set of vias electrically coupled to the second row of interconnect pads are offset relative to an alignment of the interconnect pads of the first and second rows.