The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

May. 22, 2018
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

John Claude Cadotte, Jr., Waterboro, ME (US);

Gregory Roger Martin, Acton, ME (US);

Michael Kurt Schaefer, Gorham, ME (US);

James Mark Seymour, Portland, ME (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01L 3/02 (2006.01); B29C 49/04 (2006.01); B29K 23/00 (2006.01); B29D 23/00 (2006.01); B29K 25/00 (2006.01);
U.S. Cl.
CPC ...
B01L 3/021 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0681 (2013.01); B01L 2300/0838 (2013.01); B01L 2300/0858 (2013.01); B01L 2300/12 (2013.01); B01L 2300/16 (2013.01); B29C 49/04 (2013.01); B29D 23/001 (2013.01); B29K 2023/12 (2013.01); B29K 2025/06 (2013.01);
Abstract

A pipette may comprise a length, a longitudinal axis, and an inner curved surface enclosing a space. The pipette may have a tip region having a tip thickness. The tip region may be connected to a body region having a body thickness. The tip thickness may be greater than the body thickness. The body region may be connected to a mouth region having a mouth thickness. The mouth thickness may be greater than the body thickness. The inner curved surface may not contain bumps or ridges either between the tip region and the body region or between the body region and the mouth region. The pipette may be formed by blow molding or vacuum forming.


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