The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Sep. 05, 2019
Applicant:

Ldc Precision Engineering Co., Ltd., New Taipei, TW;

Inventors:

Chi-Feng Hsu, New Taipei, TW;

Cheng-Jen Liang, New Taipei, TW;

Chih-Wei Chen, New Taipei, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/427 (2006.01); F28F 3/14 (2006.01); H01L 23/367 (2006.01); F28D 15/02 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20309 (2013.01); F28D 15/0266 (2013.01); F28F 3/14 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01); H05K 7/20318 (2013.01);
Abstract

A heat-sinking improved structure for evaporators includes at least one heat-sinking component having an outer wall board; an inner wall board extending upwards at the bottom of the outer wall board and dividing the lower portion of the interior of the outer wall board to form two water evaporation areas, and a gas concentration area formed at the top portion of the interior of the outer wall board; then, continuously arranging and combining such a plurality of heat-sinking components in the same direction thereby constituting a heat-sinking module which can be installed and sealed within an outer case in order to operate as a heat-sinking improved structure for the evaporator.


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