The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Apr. 24, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Layne A. Berge, Rochester, MN (US);
John R. Dangler, Rochester, MN (US);
Matthew S. Doyle, Chatfield, MN (US);
Joseph Kuczynski, North Port, FL (US);
Thomas W. Liang, Rochester, MN (US);
Manuel Orozco, Rochester, MN (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/10 (2006.01); B23K 26/00 (2014.01); H05K 13/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4084 (2013.01); H05K 1/116 (2013.01); H05K 3/027 (2013.01); H05K 3/105 (2013.01); H05K 3/4038 (2013.01); B23K 26/00 (2013.01); H05K 1/0251 (2013.01); H05K 13/00 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1136 (2013.01);
Abstract
A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.