The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Jun. 12, 2018
Applicant:

Ferric Inc., New York, NY (US);

Inventors:

Noah Sturcken, New York, NY (US);

Ryan Davies, New York, NY (US);

Michael Lekas, New York, NY (US);

Assignee:

Ferric Inc., New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H05K 1/18 (2006.01); H01F 41/04 (2006.01); H01F 41/02 (2006.01); H01F 27/24 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H01L 49/02 (2006.01); H01F 10/26 (2006.01); H01F 41/32 (2006.01); H01F 17/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01F 10/265 (2013.01); H01F 17/0033 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/02 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01F 41/32 (2013.01); H01L 28/10 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/165 (2013.01); H01F 2017/0066 (2013.01); H05K 1/0233 (2013.01); H05K 1/0306 (2013.01); H05K 2201/086 (2013.01); H05K 2201/0929 (2013.01); H05K 2201/1003 (2013.01); Y02P 70/50 (2015.11); Y10T 29/4913 (2015.01);
Abstract

An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.


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