The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Mar. 30, 2018
Applicant:
Samsung Display Co. Ltd., Yongin-si, KR;
Inventors:
Yi Joon Ahn, Seoul, KR;
Sung Chul Kim, Seongnam-si, KR;
Jung Hun Noh, Yongin-si, KR;
Keun Kyu Song, Seongnam-si, KR;
Hye Yong Chu, Hwaseong-si, KR;
Assignee:
SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 1/02 (2006.01); H04R 7/04 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01); H04R 17/00 (2006.01); H05K 9/00 (2006.01); H01L 51/00 (2006.01); H04R 7/16 (2006.01); H04R 7/06 (2006.01);
U.S. Cl.
CPC ...
H04R 1/028 (2013.01); H01L 27/3225 (2013.01); H01L 51/524 (2013.01); H01L 51/529 (2013.01); H01L 51/5253 (2013.01); H01L 51/5281 (2013.01); H04R 7/04 (2013.01); H04R 17/00 (2013.01); H05K 5/0017 (2013.01); H05K 7/20963 (2013.01); H05K 9/0054 (2013.01); H01L 27/323 (2013.01); H01L 51/0097 (2013.01); H01L 2251/5338 (2013.01); H04R 7/045 (2013.01); H04R 7/06 (2013.01); H04R 7/16 (2013.01); H04R 2400/11 (2013.01); H04R 2499/15 (2013.01);
Abstract
A panel bottom member includes a light absorbing member, a top bonding layer which is positioned at the top of the light absorbing member, a first vibration sound element which is positioned below the light absorbing member and bonded to the light absorbing member, a buffer member which is positioned below the light absorbing member and does not overlap with the first vibration sound element, and an interlayer bonding layer which is positioned between the light absorbing member and the buffer member.