The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Apr. 04, 2019
Anokiwave, Inc., San Diego, CA (US);
Kristian N. Madsen, Napa, CA (US);
Robert J. McMorrow, Concord, MA (US);
David W. Corman, Gilbert, AZ (US);
Nitin Jain, San Diego, CA (US);
Robert Ian Gresham, San Diego, CA (US);
Gaurav Menon, San Marcos, CA (US);
Vipul Jain, Irvine, CA (US);
Jonathan P. Comeau, San Diego, CA (US);
Shmuel Ravid, San Diego, CA (US);
Anokiwave, Inc., San Diego, CA (US);
Abstract
A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.