The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Oct. 06, 2020
Applicant:
H55 SA, Sion, CH;
Inventors:
Sébastien Demont, Les Agettes, CH;
Michaël Roger Fournier, Veysonnaz, CH;
Stéphane Pierre-Jean Boirin, Montreux, CH;
Assignee:
H55 SA, Sion, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 50/502 (2021.01); H01M 10/48 (2006.01); B64D 27/24 (2006.01); B60L 50/64 (2019.01); H01M 50/20 (2021.01); H01M 50/284 (2021.01); H01M 50/519 (2021.01);
U.S. Cl.
CPC ...
H01M 50/502 (2021.01); B60L 50/64 (2019.02); B64D 27/24 (2013.01); H01M 10/482 (2013.01); H01M 10/486 (2013.01); H01M 50/20 (2021.01); H01M 50/284 (2021.01); B60L 2200/10 (2013.01); H01M 50/519 (2021.01); H01M 2220/20 (2013.01);
Abstract
A battery module can include multiple cell tubes and a conductive plate. The multiple cell tubes can accommodate multiple battery cells within the multiple cell tubes so that individual of the multiple battery cells are positioned within individual of the multiple cell tubes. The conductive plate can include a printed circuit board. The printed circuit board can include a first conductive layer and an isolating layer. The isolating layer can include a blind hole through which a wire bonding extends. The wire bonding can be electrically connected to the first conductive layer.