The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Mar. 21, 2019
Applicant:

Flir Systems, Inc., Wilsonville, OR (US);

Inventors:

Hagit Gershtenman-Avsian, Huntersville, NC (US);

Andrey Grinman, Charlotte, NC (US);

Alexander Feldman, Los Altos, CA (US);

Alan D. Kathman, Charlotte, NC (US);

David Ovrutsky, Charlotte, NC (US);

Assignee:

FLIR Systems, Inc., Wilsonville, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 23/10 (2006.01); H01L 23/28 (2006.01); H01L 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 23/10 (2013.01); H01L 23/28 (2013.01); H01L 31/02005 (2013.01);
Abstract

An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.


Find Patent Forward Citations

Loading…