The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Aug. 05, 2019
Applicants:

Ordos Yuansheng Optoelectronics Co., Ltd., Inner Mongolia, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Liman Peng, Beijing, CN;

Qi Liu, Beijing, CN;

Yan Wu, Beijing, CN;

Jin Yang, Beijing, CN;

Qianqian Zhang, Beijing, CN;

Zhiyong Xue, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); G01R 31/28 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3276 (2013.01); G01R 31/2884 (2013.01); H01L 24/08 (2013.01); H01L 25/18 (2013.01); H01L 24/05 (2013.01); H01L 27/124 (2013.01); H01L 27/3248 (2013.01); H01L 2224/05005 (2013.01); H01L 2224/08225 (2013.01);
Abstract

An organic light emitting diode array substrate and an electronic device. The organic light emitting diode array substrate includes a display region, and a first package test electrode and a first package test lead which are outside the display region. The display region includes a first power supply line and a first signal line; the first package test lead is configured to connect the first package test electrode with the first power supply line to provide a first supply voltage for the display region; the first signal line is configured to provide a first electrical signal for the display region; and a thermal conductivity of the first package test lead is higher than a thermal conductivity of the first signal line.


Find Patent Forward Citations

Loading…