The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

May. 22, 2019
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Shu-Ming Kuo, Miao-Li County, TW;

Jian-Jung Shih, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a first substrate. The semiconductor device also includes a first light-emitting diode on the first substrate. The semiconductor device further includes a first insulating layer on the first substrate and adjacent to the first light-emitting diode. In addition, the semiconductor device includes an adhesive structure on the first insulating layer. The adhesive structure includes a first side facing the first light-emitting diode and a second side opposite to the first side. The semiconductor device also includes a second substrate disposed on the adhesive structure. The semiconductor device further includes an optical structure in contact with at least one of the first side and the second side.


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