The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
May. 13, 2019
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Zhen Zhang, Beijing, CN;
Xudong An, Beijing, CN;
Junjie Zhao, Beijing, CN;
Guangzhou Zhao, Beijing, CN;
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Sichuan, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
A method of fabricating a substrate is provided. The method of fabricating the substrate includes forming a first conductive pattern; forming a first insulating layer, and forming a first blind hole in the first insulating layer; forming a conductive film layer, and removing at least a portion of the conductive film layer in the first blind hole; thinning a portion of the first insulating layer at a bottom of the first blind hole to form a second blind hole; forming an intermediate insulating layer, and forming a second via hole in the intermediate insulating layer; removing the portion of the first insulating layer and forming a first via hole in the first insulating pattern layer; and forming a second conductive pattern. The second conductive pattern directly contacts the first conductive pattern through the first via hole and the second via hole and insulates from the intermediate conductive pattern.