The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Nov. 06, 2019
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventor:

Yoshiyuki Kawashima, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11534 (2017.01); H01L 27/11526 (2017.01); H01L 21/3213 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11534 (2013.01); H01L 27/11526 (2013.01); H01L 21/31116 (2013.01); H01L 21/32135 (2013.01);
Abstract

A second gate dielectric film material and a memory gate electrode material are formed on a semiconductor substrate. The memory gate electrode material and the second gate dielectric film material formed in a peripheral circuit forming region are removed, and a part of each of the memory gate electrode material and the second gate dielectric film material is left in the memory cell forming region. Thereafter, in a state that the semiconductor substrate in the memory cell forming region is covered with a part of each of the memory gate electrode material and the second gate dielectric film material, heat treatment is performed to the semiconductor substrate to form a third gate dielectric film on the semiconductor substrate located in the peripheral circuit forming region. Thereafter, a memory gate electrode and a second gate dielectric film are formed.


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