The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Jan. 05, 2020
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Hoang Mong Nguyen, Fountain Valley, CA (US);

Luis Eduardo Herrera, Mexicali, MX;

Sergio Joaquin Gonzalez Flores, Mexicali, MX;

Matthew Sean Read, Foothill Ranch, CA (US);

Anthony James Lobianco, Irvine, CA (US);

Heliodoro Osuna, Mexicali, MX;

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/49 (2006.01); H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 21/566 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/49 (2013.01); H01L 23/66 (2013.01); H01L 24/29 (2013.01); H01L 24/43 (2013.01); H01L 24/49 (2013.01); H01L 24/85 (2013.01); H01L 21/561 (2013.01); H01L 24/48 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/85 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

A method for fabricating a radio-frequency (RF) module is disclosed, the method including forming or providing a first assembly that includes a packaging substrate and an RF component mounted thereon, the first assembly further including one or more shielding-wirebonds formed relative to the RF component, forming an overmold over the packaging substrate to substantially encapsulate the RF component and the one or more shielding-wirebonds, the overmold formed by compression molding, and forming a conductive layer on an upper surface of the overmold such that the conductive layer is in electrical contact with some or all of the shielding-wirebonds.


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